Hauv cov ntawv thov tshwj xeeb hauv kev lag luam thiab kev tiv thaiv-xws li steel smelting, lub cav tso pa tawm, thiab cov roj drilling- yuav tsum tau ntsuas qhov siab nyob rau hauv siab - qhov kub thiab txias. Yog li yuav ua li cas lub siab sensors tiv taus qhov kub thiab txias, thiab dab tsi ua rau lub siab sensor muaj peev xwm ua rau muaj kev kub ntxhov xws li huab cua sov?
Yuav kom nkag siab txog qhov teeb meem no, peb yuav tsum pib nrog ntau lub ntsiab lus tseem ceeb: lub siab sensor nti, cov ntaub ntawv sib txuas nti, thiab cov khoom siv hluav taws xob uas ua cov teeb liab thiab ua haujlwm kub. Hauv qab no, peb yuav tham txog cov teeb meem thiab kev daws teeb meem cov khoom no ntsib thaum kub kub.
1. Siab Sensing Chip
Hom ntau tshaj plaws yog diffused silicon siab sensor nti, uas feem ntau muaj qhov siab tshaj plaws ua haujlwm kub ntawm 125℃thiab feem ntau hu ua automotive -qib nti. Rau qhov kub siab dua, SOI (Silicon ntawm Insulator) cov chips siab yog siv. SOI chips nrog txhuas electrodes tuaj yeem tiv taus kub txog 180 degree; SOI chips nrog composite electrodes tuaj yeem tiv taus qhov kub txog li 450 degree.
Sab laug:Schematic ntawm diffused silicon substrate siab nti. Lub diffused silicon nto yog doped nrog concentrated boron los ua ib tug txiv kab ntxwv - daj piezoresistive stripe cheeb tsam. Raws li qhov kub thiab txias, cov neeg nqa khoom thauj los ntawm cov cheeb tsam no tsiv mus rau hauv cov substrate, hloov pauv cov khoom tawm ntawm lub ntsuas hluav taws xob- yog li nws txwv tsis pub dhau 125℃, zoo ib yam li qhov kub thiab txias ntawm lub diode.
Txoj cai:SOI substrate qauv. Ib txheej tuab silicon dioxide nyob rau hauv nruab nrab tiv thaiv cov neeg nqa khoom los ntawm kev nkag mus rau hauv lub substrate ntawm qhov kub thiab txias, yog li txhim kho cov cua sov. Txij li thaum txhuas thiab silicon interdiffuse saum toj no 180 degree, SOI chips nrog txhuas electrodes feem ntau txwv rau 180 degree. Nrog cov electrodes sib xyaw, cov nti tuaj yeem ua haujlwm txog 450 degree.
Rau qhov kub ntau dua, silicon carbide (SiC) substrate chips yog ua haujlwm. Raws li qhov thib peb - tiam dav - cov khoom siv bandgap semiconductor, SiC ua kom lub siab sensors ua haujlwm ntawm qhov kub siab txog 650℃.
2. Chip Bonding cov ntaub ntawv
Organic adhesives siv rau chip bonding feem ntau tuaj yeem tiv taus kub txog 260 degree. Txhawm rau txhim kho qhov kub thiab txias, iav frit sintering yog siv. Iav frit yog ib qho viscous sib tov ntawm iav hmoov, organic binders, thiab volatiles. Thaum lub sij hawm siab -kub sintering, cov volatiles thiab ib feem ntawm cov organics evaporate, tawm hauv qab ib tug ruaj khov iav txheej uas ruaj khov cov nti rau nws cov hlau puag. Txij li cov khoom siv hauv qab ntawm lub siab nti yog iav, nws cov kev sib raug zoo ntawm kev ntxhov siab yog qhov zoo.
3. Kev them nqi hluav taws xob thiab qhov kub thiab txias
Feem ntau cov khoom siv hluav taws xob tsuas tuaj yeem tiv taus mus txog 125 degree, nrog qee qhov ntsuas rau 150℃lossis 180 degree. Yog li ntawd, yog tias siv cov khoom siv hluav taws xob ib txwm siv, feem ntau ntawm cov hluav taws xob hluav taws xob ntawm qhov siab - kub siab sensor feem ntau txwv rau 180℃. Rau kev khiav hauj lwm saum toj no ntau yam, resistive network them feem ntau yog siv. Txoj kev no suav nrog kev ntxiv cov khoom sib txuas lossis cov kab sib txuas mus rau tus choj Wheatstone, raws li pom hauv daim duab saum toj no. Qhov kev them nyiaj no feem ntau ua tiav qhov ntsuas kub tag nrho ntawm kwv yees li 3-5% thoob plaws qhov ntsuas kub tag nrho. Yog li ntawd, siab - kub siab sensor datasheets feem ntau qhia qhov kub thiab txias li ± 0.05% FS/degree .
